About this podcast
Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly
About this podcast
Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly
PCB Chat 74: DuPont's Andy Kannurpatti
A little over two years ago DuPont opened its Silicon Valley Technology Center. It is also finishing work on a major investment at its laminates manufacturing plant in Circleville, OH. Andy Kannurpatti, global business leader - Films & Laminates, Interconnect Solutions of DuPont Electronics & Imaging, explains how DuPont is helping the domestic industry grow.
RM 62: A Conversation with IPC Chief Technologist Matt Kelly about IPC Apex
This year’s APEX Expo is a virtual event. Matt Kelly and Mike Konrad discuss IPC's new technical conference focus and review a small sample of the upcoming technical presentations and professional development courses.
RM 61: A Conversation with Flex Circuit and Additive Electronics Expert Tara Dunn
Tara Dunn and Mike Konrad discuss the world of flex and rigid-flex circuits including flex best practices when it comes to design and use of flex technology. They also discuss the new world of additive electronics.Tara Dunn is a seasoned professional with more than 20 years in the electronics industry exclusively focused on the PCB sector. Her experience spans roles from manufacturing to sales and marketing.Tara was the founder of Omni PCB, a technical manufacturers representative for the printed circuit board industry which specializes in quickturn projects, PCB design, high-density interconnects, and RF/microwave PCBs.Tara is also the vice president of marketing and business development for Averatek which develops and licenses advanced manufacturing processes – and the key chemistries that enable them – for a variety of electronic products, including:• very high-density printed circuit boards• semiconductor packaging• RF and millimeter-wave passive componentsShe was also a founder of Geek-a-Palooza. They get into that and so much more.
PCB Chat 73: AJ Incorvaia on Desktop PCB Software
AJ Incorvaia is executive vice president of Siemens EDA, more familiarly known as Mentor. He joined Mentor in 2013 after more than 25 years in software engineering at OEMs and other major EDA vendors. He discusses the mainstream (desktop) PCB CAD market, its shift to internal sales channels, its upsides, and limitations with PCB Chat host Mike Buetow.
RM 60: Collins' Dave Hillman about Solder Voiding
Solder voiding has been with us longer than we know. Modern x-ray inspection technology has allowed assemblers to see and quantify voiding. Metallurgical expert Dave Hillman from Collins Aerospace explains the causes and possible remedies for solder voiding. Dave Hillman is a metallurgical engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa. He serves as a consultant to manufacturing on material and processing problems. He served as a subject matter expert for the Lead-free Manhattan Project in 2009. He has published numerous technical papers and was presented with the 2008 SMTA International Conference on Soldering & Reliability “Best of Conference” award and was the recipient of the SMTA “Member of Technical Distinction” Award. Dave was awarded the Da Vinci medal as a Rockwell Engineer of the Year. He serves as the Chairman of the IPC JSTD-002 Solderability committee. He’s also a member of the SMTA where he serves on the SMTA Journal and Soldering & Surface Mount Technology Journal Technical Paper Review committees. He’s a member of the American Society for Metals, the Minerals, Metals & Materials Society, and IPC. If you’re in the electronics assembly industry, you’ve probably seen Dave at numerous technical conferences, imparting wisdom with a style unique to Dave. Dave Hillman may be reached at firstname.lastname@example.org
PCB Chat 72: Matt Wrosch on Transient Liquid Phase Sintering
Matt Wrosch is senior products specialist at EMD Performance Materials. An expert in materials science, Matt has held a range of research, engineering and business development roles in the electronics industry in 1997. He has a master’s in materials science and engineering from UC San Diego and a bachelor’s from Michigan. He joins PCB Chat host Mike Buetow to discuss transient liquid phase sintering (TLPS) materials, how they compare with solder paste, conductive adhesives and TIMs, and their applications in printed circuit fabrication and assembly.
RM Episode 59: CMOS Inventor Dr. Eric Fossom
Eric Fossum is best known for the invention of the CMOS image sensor better known as the “camera-on-a-chip” used in billions of cameras, from smart phones to web cameras to ingestible pill cameras to DSLRs. In 2017, Eric was a co-recipient of the Queen Elizabeth Prize for Engineering, the world's top engineering prize (and considered by many as equivalent to the Nobel Prize) for the invention of digital imaging sensors. Eric was inducted into the National Inventors Hall of Fame and is member of the National Academy of Engineering. He is a solid-state image sensor device physicist and engineer, and his career has included academic and government research, and entrepreneurial leadership of several startups. He is the John H. Krehbiel Sr. Professor of Emerging Technologies at the Thayer School of Engineering at Dartmouth college. Eric also serves as Associate Provost of Dartmouth College for Entrepreneurship and Technology Transfer, and directs Dartmouth's PhD Innovation Programs. Eric recently co-founded another startup with his former students, Gigajot Technology, Inc.
PCB Chat 71: Is the US Ready for Smart Manufacturing?
Smart manufacturing, generally defined as the use of fully integrated, collaborative manufacturing systems that respond in real time to meet changing demands and conditions in the smart factory, in the supply network, and in customer needs, is quickly becoming reality. Is the US ready, or has it already been beaten by offshore companies? Mike Buetow considers the possibilities.
RM 58: 2020 Round-Up
On this last episode of 2020 there are no guests, no experts, no best-practice advice. Just a short recap of 2020. We just reached more than 10,000 downloads of the podcast! A HUGE thank you to my audience and my guests for making this podcast possible! On this episode I'll announce the first few guests of the 2021 season of Reliability Matters. This is looking like a terrific season! We are now producing an audio-only format and a video format. The video format may be viewed on our new YouTube channel at:https://www.youtube.com/channel/UC43S4--AIuSqlXvxmdsA7AQ Please keep your questions and topic suggestions coming! Email me at:email@example.com Thanks everyone for making this podcast successful! Mike Konrad
PCB Chat 70: Kent Balius on Front-End Engineering
Kent Balius has been at the forefront of front-end engineering for 30 years at some of the world's largest PCB fabricators. He spent the past 20 years at TTM / Viasystems, where he managed software applications and automation solutions for North America and Asia-Pacific operations. He just launched EPIC Front-End Engineering, which provides consultation, project management, software applications and development support to the PCB manufacturers, with the objectives of driving advanced automation to achieve productivity, improved quality, reduced labor costs. He speaks about how the automation of design-to-fabrication the affects Industry 4.0 implementation with PCB Chat's Mike Buetow.
RM 57: A Conversation with CAF Expert Graham Naisbitt
Conductive anodic filament (CAF) is a form of electrochemical migration (ECM). Unlike surface-level ECM, CAF exists beneath the surface of the circuit assembly. Graham and Mike Konrad discuss the causes of CAF and methods to test for and mitigate CAF. Graham has an extensive history working in the electrical and electronic manufacturing industry. Graham was the IEC 1906 Lord Kelvin Award Winner. IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards. He is vice chair of the IPC 5-30 Cleaning and Coating Sub-Committee overseeing 15 IPC Standards Development Committees. He has received 14 IPC Standards Awards and is a BSI British Standards Institution (EPL501) Member. Graham is a Specialist in Insulation Resistance Testing, Ionic Contamination Control, Solderability, Conformal Coating materials and application systems, including Cleaning, Inspection and Test.
PCB Chat 69: Manny Marcano on Changes in the Mainstream PCB CAD Market
EMA Design Automation has recently added the Mentor ECAD sales staff from Trilogic EDA. Manny Marcano, president and founder of EMA, explains what this means for the PCB CAD marketplace, and how the mainstream CAD market is shaping up.
RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding. The guests may be reached here: Tim O'Neill AIM Solder firstname.lastname@example.org www.aimsolder.com Prakash Gango StenTech email@example.com www.stentech.com Kalyan Nukala Kalyan.Nukala@zestronusa.com www.zestron.com
RM 55 - A Conversation with SMTA President Dr. Martin Anselm
Dr. Martin Anselm is a professor at Rochester Institute of Technology (RIT) and is also the newly elected president of the Surface Mount Technology Association or SMTA. Martin also worked for Universal Instruments. During his 12-year career at Universal Instruments, Martin was, among other positions, a process research engineer and manager of Failure Analysis Services. Martin completed his Ph.D. in materials science and engineering through Binghamton University. His research topic involved copper-nickel-tin intermetallic formation kinetics on electroless nickel substrates. Martin also has a master's in mechanical engineering from Clarkson and a bachelor's in physics from SUNY Geneseo.
PCB Chat Episode 68: The IPC-2581 Consortium on Electronics Data Transfer
IPC-2581 is a standard format for describing and transferring printed circuit board design and assembly manufacturing data from the OEM to fab and assembly. It is an open format developed by industry consensus through the auspices of IPC, and it is vendor-neutral. IPC-2581 is being rebranded as IPC-DPMX, which stands for Digital Product Model Exchange. On this episode of PCB Chat, host Mike Buetow is joined by IPC-2581 Consortium chair Hemant Shah, DfM expert Dana Korf, Cisco technical leader of electrical engineering Terry Hoffman, and IPC manager of design standards Patrick Crawford. They discuss the latest revision to IPC-2581, which is set to be released in November.
PCB Chat Episode 67: Brad Griffin of Cadence on EMI Simulation Tools
Brad Griffin, product management group director at Cadence, returns to PCB Chat to discuss Clarity 3D Transient Solver, a new system-level simulation solution that solves EMI system design issues up to 10 times faster than legacy 3-D field solvers, and handles workloads that previously required anechoic test chambers to ensure EMC compliance.
Reliability Matters Episode 54: A Conversation with Michael Ford about Digital Twin
Michael Ford and Mike Konrad talk about Digital Twin, its purpose, value, and its future. Michael Ford, senior director of emerging industry strategy at Aegis Software, has more than 30 years working within the electronics assembly manufacturing space. With a degree in electronics from the University of Wales, he started his career with Sony in the UK, creating software solutions as he acquired a broad range of manufacturing knowledge. He spent eight years working in Japan, which provided Ford the opportunity to expand his innovation and leadership on a global enterprise scale. Today, Ford is senior director of emerging industry strategy for Aegis Software. Having worked with specialized software solution providers in the industry, he is an established thought leader for Industry 4.0 and smart factories. He is also actively working on industry standards with the IPC, including his position as chair of new traceability standard, IPC-1782. Earlier this year, Ford's thought leadership on Industry 4.0 manufacturing and development of the IPC Connected Factory Exchange (CFX) was formally recognized when IPC awarded him with its President’s Award.
Reliability Matters Episode 53: Meet the Press - A Conversation with Industry Journalists about the State of the EMS Industry
In this episode, Mike Konrad speaks with Mike Buetow, Editor in Chief of PCD&F/CIRCUITS ASSEMBLY, Trevor Galbraith, publisher of Global SMT and Packaging, and Philip Stoten of Scoop TV. We discuss the state of the electronics assembly industry, the effects of COVID-19 on our industry, emerging technologies, and more.
PCB Chat Episode 66: Charles Hutchins Award Winner Andrew Daya on DfM and Mentoring
We hear a lot about the graying of the PCB industry. Charles Hutchins Award Andrew Daya has been working in the industry fulltime for about six years and has bachelor’s and master’s degrees in engineering from Rochester Institute of Technology. He talks about his jobs to date, which include Garmin, Anaren and Bose, how design and manufacturing can and do (or don't) work together, and what winning the Hutchins Award and getting involved in SMTA has meant for his career.
Reliability Matters Episode 52: A Conversation with Conformal Coating Expert Dr. Sean Clancy of HZO
Dr. Sean Clancy and Mike Konrad discuss the various types of conformal coatings designed to protect circuit assemblies from moisture and other hazards. They discuss coating best-practices and current IOT-based products that are increasing the need for protecting circuit assemblies from harsh environments. Clancy is director of coating technology at HZO, where he leads a group developing thin-film conformal coatings. Throughout his career, he has assisted hundreds of organizations with electronics manufacturing failure analysis, as well as developed functional coatings and materials for corrosion protection, charge storage, chemical sensing, light emission, and medical research. Sean holds an Adjunct Professor appointment at the University of Utah's Materials Science and Engineering Department and has previously provided consulting services in the STEAM fields (science, technology, engineering, arts, and mathematics). Sean earned his Ph.D. in Chemistry from the University of Southern California, his B.S. in Chemistry from the University of North Florida, and his Certificate in Project Management from the University of Delaware. Dr. Clancy may be reached here: firstname.lastname@example.org